I was wondering if anyone had any information on the quality of adhesion
between SU8 and silicon dioxide. I am trying to anisotropically etch Si with
an SiO2 mask. I have patterned a layer of SU-8 onto the SiO2 mask (intended
as a structural material). The only problem is the KOH solution causes the
SU-8 features to peel off the Si02 after a few minutes (at approx. 75 deg.
C). The features are still in tact, albeit floating in the solution...

Any help/ suggerstions would be very much appreciated!!

Thanks,

Michael

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