Hello all:
I want to wet etch one (100) wafer with KOH. Can I avoid undercutting by
aligning the features certain degrees to the <110> flat? Whether it is
vertical sidewall or not doesnot matter, but I do want to get undercutting as
small as possible.

If possible, how to align the feature? Is there some special facilities
needed? Thanks a lot.

Regards,
Yilei Zhang