Hello,

I am trying to create a microstructure on a polyimide foil with Dry Film Resist.
I am
using Sunfort AQ-5038 DFR from Asahi Kasei, and a 1,0 wt% sodium carbonate
solution as a developer.
The adhesion of the resist seems to be good after the exposure.
My problem is that after developing (puddling), the whole structure slides of
the
substrate during a rinse with DI-water. Developing takes also a lot of time ( 3
- 4
minutes). I also tried it on a copper surface, but had the same problems here.

I hope someone can give me advice.

Regards,

M. de Haas
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ing. M. de Haas
Trainee Kennis-Instituut

Hogeschool van Utrecht
Oudenoord  700
3513  EX  UTRECHT
The Netherlands

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