Raj-

        The idea with Pt dry etching is to choose your process conditions so
that
you have a very physical process. Typically Pt is dry etched with a Cl2/Ar
mixture where the concentration of chlorine is anywhere between 20% and 50%
of the total flow. You need to get below 10 mtorr process pressure and your
RIE power could be anywhere between 200 and 900 Watts depending on the
machine you are using. Etch rates will not be particularly fast, most likely
on the order of 100 nm/min, again depending on the tool configuration. If
you are using photoresist as a mask, you need to take special care to make
sure that the resist does not carbonize. I hope this helps.

Michael Marrs
Process Engineer
Trion Technology



-----Original Message-----
From: Raj Kumar [mailto:[email protected]]
Sent: Thursday, November 13, 2003 10:06 PM
To: [email protected]
Subject: [mems-talk] Dry etching of Platinum



Hello Friends!
       I was looking for some dry etch recipe for patterning Platinum
with 1 micron dimensions. In addition to that I was also looking for the
stability of Platinum in KOH and TMAH based wet anisotropic etching. Any
guideline and/or reference in this context will be highly appreciated.

Rajkumar,India