Hi all,

I want to use SU-8 2005 in order to fill a gap inside of my si wafer. The
dimension of the gap is: L=3mm, W=150 um, and Hieght= 550 um. I have a
condition for 5um thickness from microchem but my thickness is abour 550 um. I
think I should use SU-8 2005 b/c the gap is too samll. I appreciate if any body
has the condition (soft bake times, exposure time , ..) for this high thickness.

Best regards,
Hasan Sharifi
Purdue University