Dear all,

I have a question about handling of the chip after  alignment and before
reflow of the solder during flip-chip bonding process.

What keeps the die-chip pair fixed while moving it to the reflow furnace. Is
  it that the surface tension of the flux is simply enough to keep them
together under normal handling conditions? If so, what about fluxless
applications?


Thanks
Serhan Ardanuc
Cornell University

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