Hi,
I would need to know of papers in the literature talking about these two
subjects:
-Silicon oxide and/or silicon nitride damages appeared during
anisotropic (TMAH) etching. Where Silicon oxide and silicon nitride are
the mask materials.
-KOH contamination of silicon (bulk lifetime degradation).

I would appreciate any help,
Thanks in advance,

Sandra Bermejo
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GDS Semiconductor Devices Group