Dear All;

I am trying to fabricate some micromachined structures.

I made a sharp silicon tip ,which has (411) plane,  using the compensation
mask.
And I want to deposit the metal layer and keep the shape of tip sharp.


(1)  I tried to electroplate to deposite metal layer. but somebody said that
the concentration of electric field on the tip will be more deposition than
other
area, and that results in round shape of the tip.

However, I have not tried electroplating yet. (including the pulse assisted
electroplating)

(2) If the concentration of the electric field become problem, how about
using sputtering ?
    Because there will be no concentration of electric field, so all area of
the tip will be
deposited equally. But I have not found the example that the sputtered metal
can be
used as a structure .

 If I use the sputtered metal. I should deposited over 10 micron in
thickness.

 Can I share your opinion which process will be alright. and If you have
some information
on sputtered metal used as a structure, please let me know that.

Thanks.



Choe,S-H
Esashi Lab. Tohoku University, Japan
E-Mail: [email protected]