Hi,

I am looking for some suggestions for MEMS wafer dicing, either suitable
techniques or mature service provider. What I am working on is 4 inch wafer
made by wafer bonding and bulk micromachining. The device can not be exposed
to water as you know. I have tried laser dicing; the results are not very
good.

I really appreciate your suggestions and information.

Best regards,

Qingwei