To follow up on Greg's comment,
I've used DRIE dicing in several ways:
1. Attach the product wafer to a backing wafer with photoresist or another
adhesive, then etch all the way through.
2. If you're using an SOI wafer, on the thin side, etch the die outline, but
leave some silicon for tethers.
Next, etch the die outline from the thick side.
Remove the wafer from the etcher. Break the dice out of the wafer.
I know of one place that is actually using DRIE dicing for production.
--Kirt Williams, Ph.D. consultant
----- Original Message -----
From: "Greg Ortiz"
To: "General MEMS discussion"
Sent: Tuesday, December 09, 2003 1:40 PM
Subject: Re: [mems-talk] RE: MEMS wafer dicing
> Some organizations are considering doing dicing in an ICP configured for
> Deep Si Etch. If you would like more information do not hesitate to
contact
> me.
> Cheers,
> Greg Ortiz
> Surface Technology Systems
> West Coast Regional Sales Manager
> 611 Veterans Blvd., #107
> Redwood City, CA 94063
> Phone 650 569 3655 x16
> Mobile 408 499 5689
> Fax 650 569 3663
> Email [email protected]
> www.stsystems.com
> ----- Original Message -----
> From: "Qingwei Mo"
> To: "'Qingwei'" ; "'General MEMS discussion'"
>
> Sent: Sunday, December 07, 2003 9:34 PM
> Subject: [mems-talk] RE: MEMS wafer dicing
>
>
>
> Hi,
>
> I am looking for some suggestions for MEMS wafer dicing, either suitable
> techniques or mature service provider. What I am working on is 4 inch
wafer
> made by wafer bonding and bulk micromachining. The device can not be
exposed
> to water as you know. I have tried laser dicing; the results are not very
> good.
>
> I really appreciate your suggestions and information.
>
> Best regards,
>
> Qingwei
>
>
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>
>
> _______________________________________________
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