The short answer is Yes.  The plasma reaction can be increased with 1) more heat
and 2) extra help from more active gasses.  This should be relatively easy to
remove.  The most difficult to remove material we had to deal with recently was
8 microns of Polymide that had been hard baked at 450 degree C.  In this case we
were at 270 C in the plasma reactor.  With the addition of up to 30% CF4 we
could remove the film in 4 minutes.  Contact me directly and I will arrange to
remove material for you.  Bill Moffat Yield Engineering Systems.

-----Original Message-----
From: Joonyeop Lee [mailto:[email protected]]
Sent: Wednesday, December 10, 2003 5:18 PM
To: [email protected]
Subject: [mems-talk] Can you strip the hard cured BCB?


Hi everyone.

I have a question to ask and would highly appreciated the help.

I have used BCB(Benzocyclobutene) as low-k dielectric and it was hard cured at
250℃.

But i want to strip hard cured BCB.

Do you know any process or stripper that can strip it ?

Sincerly
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