Hi, Kirt,

For the first way you mentioned, does it have to go through a CPD process
afterwards?

Thanks

Qingwei

-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of Kirt
Williams
Sent: 2003年12月10日 17:46
To: General MEMS discussion
Subject: Re: [mems-talk] RE: MEMS wafer dicing

To follow up on Greg's comment,
I've used DRIE dicing in several ways:
1. Attach the product wafer to a backing wafer with photoresist or another
adhesive, then etch all the way through.
2. If you're using an SOI wafer, on the thin side, etch the die outline, but
leave some silicon for tethers.
Next, etch the die outline from the thick side.
Remove the wafer from the etcher. Break the dice out of the wafer.

I know of one place that is actually using DRIE dicing for production.

    --Kirt Williams, Ph.D.   consultant