Hello,
We have the same kind of problem using adhesive bonding procedure.
We found out a no-well bonded area near the center pin position.
The TTV is less than 1µm, the problem could be related to the central pin I
think but it's under investigation.
Best Regards.
Kenneth Smith a écrit :
> Melvin,
>
> It is likely that your wafers are not flat enough as you suspect. For
> Bonding- wafers should have TTV < 2um and preferablly <1um- which is
> best obtained with Double Side Polished wafers.
>
> Ken
>
> Melvin DeSilva wrote:
> >
> > Hello,
> >
> > I need to do Au-Au thermal compression bond using Karl Suss bonder.
> > Sometimes the bonding is not uniform across the wafer. I understand
> > that it could have been caused by particles on the wafer or film
> > uniformity, etc. My question is:
> >
> > Is there a requirement for wafer flatness (TTV less than ?? um) in order
> > to achieve a uniform bond. Any comments and suggestions are appreciated.
> >
> > Melvin
> >
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