Hi Melvin,
Wafer flatness and surface roughness are two parameters that will cause bonds to
fail but there are also many other steps that need to be checked too.  Give me a
call and I can set you up with some of the recipes we have used on the SB6e
project.  I can even give you a recipe to run on your tool.

Brad Johnson
Suss MicroTec
Applications Engineer
Phoenix 1-480-557-9370 Ext119
Vermont 1-800-685-7877 Ext305
[email protected]


>>> [email protected] 12/09/03 05:26PM >>>

Hello,

I need to do Au-Au thermal compression bond using Karl Suss bonder.
Sometimes the bonding is not uniform across the wafer.  I understand that it
could have been caused by particles on the wafer or film uniformity, etc.
My question is:

Is there a requirement for wafer flatness (TTV less than ?? um) in order to
achieve a uniform bond.  Any comments and suggestions are appreciated.

Melvin

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