Hello,

To evaporate gold on oxide surface, usually one uses a layer of chromium
or titanium as an adhesion layer.

What now if I would want to deposit oxide (PECVD) on top of a gold
surface. Should I put an adhesion layer on top of the gold? And if so,
would it matter if I break vacuum while doing this? (i.e. I have to take
the wafer from the evaporator to the PECVD, so the adhesion layer could
oxidize a bit on the way.)
The gold surfaces I am using are quite large (500microns x 5millimeters)

Does anybody have any experience on this?

Furthermore, should I expect problems when PEVCD oxide on aluminum?
Again, I can imagine that the oxide layer on the aluminum could affect
the adhesion.

Thank you,

Sjoerd Haasl


Royal Institute of Technology
Department of Signals, Sensors and Systems
Microsystem Technology
Stockholm, Sweden