Greetings,

We are using a MicroAutomation dicing saw and diamond dicing wheels to
separate pressure sensors from the silicon wafer/ glass plate assembly.
There are holes on the top and bottom sides of the sensors for access to
the silicon diaphragm. We currently apply a layer of dicing tape across
the top side of the assembly to prevent water and debris from entering
the holes, dice through the tape, and remove tape after dice. Some water
gets under the tape at dice. Any ideas of successful tapes and/ or other
methods of protecting sensors at dice?

Rich Hjulstrom, Sr. Microelectronics Engr.
Jim Stackhouse, Sr. Manufacturing Engr.