A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: via through pyrex
via through pyrex
2003-12-15
Paolo Bondavalli
2003-12-17
David Nemeth
2003-12-17
Steven F. Nagle
2003-12-17
Choe,S-H
2003-12-16
[email protected]
via through pyrex
Choe,S-H
2003-12-17
Dear Paolo

I wish this paper will help your research.

Dong-Weon Lee, Takahito Ono, Takashi Abe, and Masayoshi Esashi, "Microprobe
Array With Electrical Interconnection",
Journal of Microelectromechanical systems, vol.11, No.3, Jume 2002

S-H, Choe Esashi-Lab
Tohoku University
E-Mail: [email protected]

----- Original Message -----
From: "Paolo Bondavalli" 
To: 
Sent: Tuesday, December 16, 2003 2:03 AM
Subject: [mems-talk] via through pyrex


> Hi all!
> I'm looking for refrences, papers, articles related to realization of
> via in pyrex wafer using Drie etch process and metalization of these
> ones.
> Thank you very much.
>
> *********************************************************
> Dr. Paolo Bondavalli
> R&D MEMS Engineer
> MICROTEC MEMS
> THALES (ex THOMSON-CSF) CORPORATE RESEARCH CENTER
> Domaine de Corbeville,
> Route Departementale 128
> F91404 ORSAY
> (FRANCE)
> Tel : 01 69 33 08 63
> Fax : 01 69 33 08 62
> Email : [email protected]
> **********************************************************
> Disclaimer: Opinions expressed herein are my own and may
>   not represent those of my employer.
> **********************************************************
>
>
>
>
>



reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
MEMS Technology Review
Tanner EDA by Mentor Graphics
University Wafer
Process Variations in Microsystems Manufacturing