> To evaporate gold on oxide surface, usually one uses a layer of chromium
> or titanium as an adhesion layer.
>
> What now if I would want to deposit oxide (PECVD) on top of a gold
> surface. Should I put an adhesion layer on top of the gold? And if so,
> would it matter if I break vacuum while doing this? (i.e. I have to take
> the wafer from the evaporator to the PECVD, so the adhesion layer could
> oxidize a bit on the way.)
> The gold surfaces I am using are quite large (500microns x 5millimeters)
>
> Does anybody have any experience on this?

That's a good question.
I've put PECVD oxide directly on  plated gold and the adhesion was fine.
A lot of further processing (PECVD nitride, more gold) was also done, with
no adhesion problem.
    --Kirt Williams, Ph.D.   consultant