Your debris might be silicon slurry residue from the die saw process.
Increase the water flow as much as will not damage your devices so that
the slurry never dries on the surface.

If it is slurry residue and the above did not help, there is little you
can do to get it off because the debris is silicon, same as your wafer
and perhaps surface.

One possible way to avoid this situation is to coat the wafer with
resist before die-saw.  Cleaning the resist and debris off later is then
a matter of containing the small pieces in some sort of basket (made of
screen perhaps) during acetone or piranha and rinse.


Jen Robertson wrote:

>Hi-
>
>Is there a good way to clean small (<5mm square) silicon chips? Our chips have
lots of visible residues after the dicing process, either from the dicing tapes
or wafer dusts. We have tried soaking in many different solvents but cannot seem
to get rid of them. These chips have fragile MEMS structures on them and will
break if we use ultrasonic agitation. Any suggestion would be greatly
appreciated. Thanks!
>
>
>Jen
>
>
>