Hi You may like to use surfactants such as diamalub and others. Do contact
companies like Keteka, Dynacraft as they offer such solvents. You need to
dilute this solvent with DI water and soak the dies for sometime. Check with
the vendors for DI water to solvent mixing ratio.
This mixture reduces the surface tension of water and can release the saw
dust particles from die surface.
You may use citric acid if you can not get this solvent and use in the same
way. May be use 1: 10 ratio for citric acid (1 part citric acid and 10 parts
water).
Let me know if it works. Good Luck. Vish


----- Original Message -----
From: "Steven F. Nagle" 
To: "General MEMS discussion" 
Sent: Tuesday, December 23, 2003 2:03 AM
Subject: Re: [mems-talk] cleaning small chips


> Your debris might be silicon slurry residue from the die saw process.
> Increase the water flow as much as will not damage your devices so that
> the slurry never dries on the surface.
>
> If it is slurry residue and the above did not help, there is little you
> can do to get it off because the debris is silicon, same as your wafer
> and perhaps surface.
>
> One possible way to avoid this situation is to coat the wafer with
> resist before die-saw.  Cleaning the resist and debris off later is then
> a matter of containing the small pieces in some sort of basket (made of
> screen perhaps) during acetone or piranha and rinse.
>
>
> Jen Robertson wrote:
>
> >Hi-
> >
> >Is there a good way to clean small (<5mm square) silicon chips? Our chips
have lots of visible residues after the dicing process, either from the
dicing tapes or wafer dusts. We have tried soaking in many different
solvents but cannot seem to get rid of them. These chips have fragile MEMS
structures on them and will break if we use ultrasonic agitation. Any
suggestion would be greatly appreciated. Thanks!
> >
> >
> >Jen
> >
> >
> >
>
>
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