after the spin cycle has completed, inject solvent from the bottom in
direction of the rim while spinning the wafer at ~400-500RPM. then spin few
seconds at ~3000RPM for drying
Shay

Yuzhu Li wrote:

> I have been using "cover-expose-develop" method to remove edge bead of
> positive resist. I had to use aceton Q-tip to srub negative eadge bead, is
> there a better way?
>
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