As i mentioned in my previous mail, the problem was solvent residue from
the development of the first layer.I thus prebaked the wafer on a hotplate
for a few minutes before spin - coating the second layer of the SU-8
50.Also, the prebake times of the second layer were extended to 25 mins at
65C and 75mins at 90C.Note though that these are preliminary results.

Regards
Anthimos Kanteres
Microsystems Engineering Centre
Edinburgh,UK


On Tue, 23 Dec 2003 09:44:49 +0000 (GMT), [email protected] wrote:

> Dear experts,
> thank you for your valuable input.Preliminary results indicate that
> the
> wrinkling issue has gone away!The problem must of have been solvent
>
> residue from the development of the first layer "reacting" in some
> way
> with the SU-8 during baking.A combination of your recommendations
> has been
> successful.Thanks again and i wish you all merry christmas and a
> happy new
> year!
>
> Anthimos Kanteres
> Microsystems Engineering Centre
> Edinburgh,UK
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