Hello,

I was wondering if anyone had any experience with the use of Shipley Eagle
ED 2100 resist. I am trying to coat layers in excess of 20 um onto copper
layers for use as electroplating moulds. The problem is that adhesion
between the copper and the ED 2100 layer is quite poor, encouraging the
resist to flake-off both during and after electroplating.

Has anyone encountered similar problems with this resist? Could anyone
recommend steps to alleviate such problems?

Regards,

Michael

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