Li,
Evaporation is always the best method for doing lift-off due to its
line-of-sight deposition.  Sputtering, besides getting your resist too hot,
will also get under your over hang making the film harder to break and
lift.

Brent

Yuzhu Li wrote:

>  sputtered Ni 1500A. I tried  both negative resist(AZnlof, 4um with
> overhang) and positive resist(AZ5214, 1.5um), after liftoff, they both
> give rough edges: some metal still hang over the edge.why even negative
> resist doesn't work? should I use evaperation Ni?
>
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