Hi Trisha
           EVG can incorporate edge gripping for dual side wafers if
needed on their automatic handling systems but there are some trade offs
depending on Bow etc. www.EVGroup.com
Regards

Jan Newman

>Can anyone direct me to a vendor that makes automation for edge gripping
>of dual sided wafers?  I had heard that Suss Microtech had something
>incorporated into their system, but not sure-
>
>Trisha
>
>
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--
newman