The undercut is a result of two processes. one is groove to xtal
missalignment and the other 100 to 111 selectivity.
you should be able to evaluate both for your process.
Shay
----- Original Message -----
From: "Isa Kiyat" 
To: 
Sent: Thursday, January 08, 2004 8:52 AM
Subject: [mems-talk] Undercut in KOH etching of (100) Si


> I always get some undercut when etching grooves on (100) Si wafer using
KOH+Isopropyl alcohol. I use PECVD nitrate mask. Is that a regular result?
Is there any analytic equation for this undercut? Can it be estimated?
> Comments and/or references are appreciated.
> Thanks.
> ===================================
>
> Isa Kiyat
>
> Bilkent University
> Department of Physics
> 06800
> Ankara, Turkey
>
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