Dear Tennyson Nguty,

Polyimides is not resistant to KOH in the concentrations normally used for
etching silicon (>10 wt.%). The main problem is the fast lost of adhesion,
resulting in film peal-off. The polyimide will disintegrates in KOH after a
while
depending on the concentration.

Regards,
Gert Eriksen

Grundfos Semiconductor
Ryttermarken 15-21, DK-3520 Farum, Denmark
Tel.: +45 44 34 71 60, Fax: +45 44 34 71 72



On 19 Jan 2004 at 12:08, tennyson nguty wrote:

> Dear MEMS-talk members,
>
> Can someone advice on polyimides resistant to KOH etching.
>
> Regards
> Dr. Tennyson Nguty
> Microsystems Technology Group, School of Engineering, University of
> Durham, South Road, Durham DH1 3LE. Tel:  0191 334 2525, Fax:     0191
> 334 2407
>
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