Hello,
I need help with chemical wafer-glass bonding.
I am trying to bond glass slides to wafers with spin-on glass 400F
(methylsilsesquioxane).  I spin on SOG on the glass at 4000 rpm, bake
on hot plate at 90 C for 60 seconds, clamp onto the Si wafer and bake
in an oven at 200 C for 4 hours.
The problem is there is always a few micron gap between glass and Si
wafer no matter how tight I clamp the two pieces together.  The two
pieces are still held together at some places.
I wonder if anyone can help me to get rid of the gap.

Thank you very much,
Woo

University of Notre Dame
Notre Dame, IN 46556