you have different solutions to avoid this adhesion problem...

first of all, you can depose a full wafer layer of SU8 2002 that you hard
bake at the end  1min at 150°C...

second solution... deposition of fluorocarbone (CHF3) on your mould by RIE
to permit an easiest peeling...

that's it... good luck

Matthieu

----- Original Message -----
From: "Juntao Xu" 
To: 
Sent: Tuesday, February 03, 2004 8:01 PM
Subject: [mems-talk] SU-8 adhension problem


> Hi,
>
> I use SU-8 (2000 series) to make multilever mould for PDMS microfludics. I
> tried both silicon and glass as the substrate. The SU-8 exposure and
> development are fine, the mould looks good. But when I peeled PDMS from
the
> mould, most of the SU-8 structure are peeled off with PDMS, the mould
can't
> be reused. It seems the adhension between SU-8 and the substrate is very
> poor. Anyone could give me some suggestionon how to improve the adhesion?
If
> I need underexpose SU-8 to improve the adhension? Thanks!
>
> Juntao
>
> _________________________________________________________________
> Tired of spam? Get advanced junk mail protection with MSN 8.
> http://join.msn.com/?page=features/junkmail
>
>
> _______________________________________________
> [email protected] mailing list: to unsubscribe or change your list
> options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
> Hosted by the MEMS Exchange, providers of MEMS processing services.
> Visit us at http://www.memsnet.org/
>