Hello all,

I am currently using the UV-LIGA process with SU-8 to fabricate metallic MEMS
devices as part of my PhD work. Since my devices are removed from the substrate
after fabrication I use the cheapest wafers possible, onto which I deposit a
conductive seed layer by chemical vapour deposition to form a plating base. I
was wondering if anyone has experience using a suitable conductive substrate
which cuts out the need to deposit the conductive seed layer and hence save on
processing time. I have noticed that SU-8 does not adhere well to some surfaces
such as copper. I have also noticed that substrates which do not have a mirror
finish result in poor quality features, presumably because of scattering. It
would be much appreciated if anyone has any suggestions on potential conductive
substrates that I can try for my process.


Mark