Perhaps you could use a heavilly doped wafer.

-Mike Martin

>>> [email protected] 2/11/2004 5:58:36 AM >>>
Hello all,

I am currently using the UV-LIGA process with SU-8 to fabricate
metallic MEMS devices as part of my PhD work. Since my devices are
removed from the substrate after fabrication I use the cheapest wafers
possible, onto which I deposit a conductive seed layer by chemical
vapour deposition to form a plating base. I was wondering if anyone has
experience using a suitable conductive substrate which cuts out the need
to deposit the conductive seed layer and hence save on processing time.
I have noticed that SU-8 does not adhere well to some surfaces such as
copper. I have also noticed that substrates which do not have a mirror
finish result in poor quality features, presumably because of
scattering. It would be much appreciated if anyone has any suggestions
on potential conductive substrates that I can try for my process.


Mark
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