Mark,

Call Microchem and ask them about Omnicoat.  It is an adhesion/release
layer for SU-8 on metals.  I know that it works on gold.  They claim
that it works on copper, though I have never tried it.  It may open up
some options for you.

Greg Reimann
Boston University


Hello all,

I am currently using the UV-LIGA process with SU-8 to fabricate metallic
MEMS devices as part of my PhD work. Since my devices are removed from
the
substrate after fabrication I use the cheapest wafers possible, onto
which I
deposit a conductive seed layer by chemical vapour deposition to form a
plating base. I was wondering if anyone has experience using a suitable
conductive substrate which cuts out the need to deposit the conductive
seed
layer and hence save on processing time. I have noticed that SU-8 does
not
adhere well to some surfaces such as copper. I have also noticed that
substrates which do not have a mirror finish result in poor quality
features, presumably because of scattering. It would be much appreciated
if
anyone has any suggestions on potential conductive substrates that I can
try
for my process.


Mark