Hello All,

This is Tetsuya Kishino with Kyocera corporation, Japan.
I'm trying to fabricate a metal post on a Si substarte.  The dimensions of the
post should be 100 microns in diameter
and 300 microns in height.  I'm thinking of some techniques such as electro-
plating with solder resists, solder-filling,
or multi-layer Au bump...
However, I'm doubting these techniques because the post may be too high and the
aspect ration may be too large.

Is anyone know:
 - a solder resist for 300 microns in thickness?
 - whether we can fill the hole of 100 microns in diameter and 300 microns deep
by solder-printing?
 - materials suitable for the metal post?
 - or any idea to fabricate the metal post?

Any advice or suggestion will be welcome.
Thanks

Tetsuya Kishino
Kyocera corporation, Japan