Chi Anh,
        Trying to ash Polymide is a difficult job.  My company manufactures
Polymide bake units and strippers for resist and Polymide.  You need to give me
more details.  Is your Asher an old barrel stripper, or a single wafer microwave
unit.  For example we can remove 8 microns of hard baked Polymide in 4 minutes
with the correct gas and plasma unit.  Contact me directly and I will go into
process things to try to avoid a lengthy commercial on this site.  Bill Moffat

-----Original Message-----
From: ASIC Hello [mailto:[email protected]]
Sent: Thursday, February 19, 2004 12:37 AM
To: [email protected]
Subject: [mems-talk] problem with polyimide ashing


Hi all,

I am trying to ash polyimide PI2610 patterns using
Plasma-finish asher. My polyimide patterns are 50 um x
50 um and about 2.2 um thick. Masking layer for
polyimide is SiNx layer. However ashing process seems
to be slow (60 ~ 90 minutes). My recipe is:

O2 400 sccm
N2 50 sccm
Pressure 200 Pa
Power 400 W .

In additionally, thin film of 1200 A of gold beneath
PI2610 is etched. There is black residue on gold film.

Could anyone advice me a better PI ashing recipe,
which can prevent gold layer and ash PI2610 faster?

Thank in advance

Chi Anh

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