Hi Marie,

We have an Oxford ICP RIE which has an Alumina tube for the ICP and an Alumina
clamping mechanism for the wafer.  Although we have had it this way from day
one, we have no problems with any of our processes.
--
Shane McColman
Research Professional
NanoFab, University of Alberta
W 1-028 ECERF Building
Edmonton AB, Canada, T6G 2V4


On February 19, 2004 02:18 am, Tripp, Marie Kathleen wrote:
> Hi,  Thank you for your responses to my question about etching Silicon
> without affecting Alumina (Al2O3).  Several people suggested using SF6 dry
> etch.  I do have SF6 available in an ICP that is typically used to run the
> Bosch process for deep trench etching.  The system can easily be used
> without the passivation step to allow for an isotropic etch with SF6.  Does
> anyone know if introducing Alumina (Al2O3) to the system will cause a
> contamination problem for others?  Any experience that will help calm my
> co-workers or save me from contaminating an expensive piece of equipment
> would be greatly appreciated.
>
> Thanks,
> Marie Tripp
>
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