Tetsuya,

I have seen literature that reports good results for creating high aspect
ratio metal posts by Localized Electrochemical Deposition.  For example see
Journal of Electrochemical Society, 147 (2) pg. 586, 2000 article by E. M.
El-Giar et al.

Eddie Blackwell
Oregon State University


----- Original Message -----
From: "Tetsuya Kishino" 
To: 
Sent: Wednesday, February 18, 2004 9:46 PM
Subject: [mems-talk] Metal posts with high aspect ratio


> Hello All,
>
> This is Tetsuya Kishino with Kyocera corporation, Japan.
> I'm trying to fabricate a metal post on a Si substarte.  The dimensions of
the post should be 100 microns in diameter
> and 300 microns in height.  I'm thinking of some techniques such as
electro-plating with solder resists, solder-filling,
> or multi-layer Au bump...
> However, I'm doubting these techniques because the post may be too high
and the aspect ration may be too large.
>
> Is anyone know:
>  - a solder resist for 300 microns in thickness?
>  - whether we can fill the hole of 100 microns in diameter and 300 microns
deep by solder-printing?
>  - materials suitable for the metal post?
>  - or any idea to fabricate the metal post?
>
> Any advice or suggestion will be welcome.
> Thanks
>
> Tetsuya Kishino
> Kyocera corporation, Japan
>
>
>
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