Dear all:

I've designed a polysilicon structure which consists a cantiliver beam and a
square pad.
The pad, 610 um*610 um*2 um, is located at the free end of the cantilever beam.
The beam is 800 um long, 10um wide, 2 um thick.
It means the length of the whole structure is 1410 um in total.
I have some trouble in reduing the residual stress and releasing procedure.
After releasing the structure, the yield rate of the structure is low.
Would you please give me any recommemdation to my fabrication process?
Or any useful annealing recipe and releasing technique for me?
Thank you for your time!!

Y.C. Lin
National Tsing Hua University, Taiwan.