John, seems to me a good way to do that would be to deposit a metal or
thermosplastic around the hole, put the substrate in a vacuum chamber, pull
a vacuum then heat the substrate thereby sealing the hole.  Whadya think,
Gary

-----Original Message-----
From:   Robert Dean [SMTP:[email protected]]
Sent:   Tuesday, February 24, 2004 4:09 PM
To:     General MEMS discussion
Subject:        [mems-talk] Microfluidic interconnect

Hello,

I need an interconnect for a silicon microfluidic device that I can pull a
weak vacuum on, then crimp the interconnect closed and remove the vacuum
source (tubing) and still maintain a weak vacuum inside the microfluidic
device.  Does anybody have a suggestion on where I can obtain such an
interconnect or nozzle, and then attach it to my silicon microfluidic
device?  The diameter of the hole in the silicon substrate that the
interconnect attaches to is approximately 80um.  Thanks.

Sincerely,

Robert Dean

Research Associate IV
Center for Advanced Vehicle Electronics
Auburn University
200 Broun Hall
Auburn, AL 36849

Voice: 334-844-1838
Fax:   334-844-1898
Email: [email protected]
Web: http://www.eng.auburn.edu/~deanron


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