Generally, I use AZ1518 photoresist (2 microns) to etch 400nm of SiO2.
at the end of the process (about 6 min ) the photoresist is still there and
doesn't seems to be attacked by HF 50%.

I hope it will help you

Matthieu
----- Original Message -----
From: "Brent Garber" 
To: "General MEMS discussion" 
Sent: Tuesday, February 24, 2004 4:30 PM
Subject: Re: [mems-talk] Mask for concentrated HF


> Hiroaki,
>
> I have always used sputtered Cr/Au.  Depending on glass thickness will
> determine if you will get much or any under cutting.
>
> Brent
>
> Hiroaki SUZUKI wrote:
>
> > Hi all
> >
> > Please allow me to ask one simple question. it might be in the past
> > discussion...
> > What is the best mask material for the glass etching with concentrated
HF?
> >
> > Hiroaki
> >
> > _______________________________________________
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>


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