Have you tried heating the nanostrip/pirana etch up? That will reduce
the viscosity.

-Mike


>>> [email protected] 2/27/2004 4:43:45 PM >>>
Hi!
   I had to bond a pair of wafers using OCG thick resist. Deep RIE was
done to etch holes on the top wafer. Now that etching is done, I am
unable to separate the wafers. I have tried nanostrip & WNRD to remove
OCG. But no success so far. Any helpful suggestions would be
appreciated.


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