Jin,

Hello.  I recommend the following paper: "Fabrication of Wafer-Level
Thermocompression Bonds," C. Tsau, S. Spearing and M. Schmidt, J.
Micromechanical Systems, Vol. 11, No. 6, Dec. 2002, pp. 641-647.  It covers
wafer bonding using gold thermocompression bonding.

Sincerely,

Robert Dean
Auburn University

At 11:56 PM 3/1/04 -0800, you wrote:
>Hello, list members
>I am trying to bond three wafers together, and want to know if Au-Au can
>be boned tightly, if it works , what is the principle, and in what
>condition it will be bonded.
>Thanks for any related answers.
>
>Jin, Jiandong
>
>
>
>
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