Jin Jiandong,

Gold bonding can indeed be used for a strong wafer-level bond. A lot of good
information on this process has come out of MIT.  One paper is "Wafer-Level
Thermocompression Bonds" by Tsau, Schmidt, and Spearing at MIT, from Advanced
Materials for Micro- and Nano-Systems (AMMNS), Jan 2003. Wafer preparation,
process, and equipment are discussed.

Best Regards,

Chad Brubaker

EV Group       invent * innovate * implement
Technology - Tel: (602) 437-9492, Fax: (602)437-9435 e-mail:
[email protected], www.EVGroup.com

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 -----Original Message-----
From:   [email protected] [mailto:mems-talk-
[email protected]]  On Behalf Of jane jin
Sent:   Tuesday, March 02, 2004 12:57 AM
To:     [email protected]
Subject:        [mems-talk] Au-Au bonding

Hello, list members
I am trying to bond three wafers together, and want to know if Au-Au can be
boned tightly, if it works , what is the principle, and in what condition it
will be bonded.
Thanks for any related answers.

Jin, Jiandong




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