Robert,
The bond methods you mention below can be used for a variety of applications;
the choice would really depend on the application and specific qualities of bond
that you are looking for. For instance, two of the methods you mention below
(gold Thermocompression, eutectic solder wafer bonding) provide conductive
joins, and are suitable for creating devices where the top wafer and bottom
wafer "talk" to each other. In the other two cases (fusion, anodic), you are
looking more at mechanical assembly, be it encapsulation or building a
multilayer mechanical device.
BCB is a great material to use for bonding two silicon wafers together, but you
have to bear in mind that it is a passivation material, and as such, cannot be
used for conductive bonding unless further processing steps are performed.
Depending on what qualities you are looking for in terms of conductivity,
hermeticity, and thermal stability, not to mention whether you desire the bond
to be temporary or permanent, it could dictate any of a large range of
materials If you wish to discuss this further, please contact us using the
information below.
Best Regards,
Chad Brubaker
EV Group invent * innovate * implement
Technology - Tel: (602) 437-9492, Fax: (602)437-9435 e-mail:
[email protected], www.EVGroup.com
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-----Original Message-----
From: [email protected] [mailto:mems-talk-
[email protected]] On Behalf Of Robert Dean
Sent: Thursday, March 04, 2004 9:01 AM
To: General MEMS discussion
Subject: [mems-talk] adhesive based wafer bonding
Hello,
Does anyone know which adhesives have been successfully used to bond
silicon wafers together, in place of fusion, anodic, gold thermocompression
or eutectic solder wafer bonding?
Sincerely,
Robert Dean
Auburn University
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