High Aspect Ratio Microstructure Technology 1995

                                  HARMST '95
                              Karlsruhe, Germany
                                July 3-5, 1995

                    First Announcement and Call for Papers

Objective:

Provide a platform for exchanging information on various microstructure
technologies, materials, handling methods, and theoretical tools used to
produce high aspect ratio devices as well as on products and applications.

Program:

The program is organised in oral and poster sessions according to the key words
given below with the aim to avoid parallel sessions. Sessions will be opened by
invited talks and may comprise extended talks. Conference language is English.

Processes and Materials
    Primary structuring in thick layers
    Microelectroforming
    Micromolding
    Surface and interface properties and preparation
    Assembly, interconnection, packaging
    Theoretical aspects
Products and Applications
    Devices and systems
    Fields of applications

A visit to Forschungszentrum Karlsruhe (KfK) with tours to the main
microstructuring facilities is planned on Thursday, July 6.

Invited speakers:

Confirmed invited speakers include W. Ehrfeld, H. Guckel, A Heuberger, R.
Kassing, W. Menz, J. Mohr, L. Romankiew and R. Wechsung.

Deadlines:
Early Registration: May 31, 1995
Abstract: May 1, 1995
Full Paper: July 3, 1995

A book of abstracts will be available at the start of the conference.

For more information contact:
Dr. H.O. Moser
Forschungszentrum Karlsruhe/PMT
Postfach 3640, D-76021 Karlsruhe, Germany
email: [email protected]
Fax: +49 7247 82 5579

or

Karen W. Markus
MCNC
PO Box 12889
RTP, NC 27709-2889
email: [email protected]
fax: 919 248 1455