Abhiram,
Microchem Corp (www.microchem.com), the company that manufactures the SU-8
resist line, actually has a release material already defined for the releasing
of SU-8 layers.
The material is PMGI. There are several different grades of this material
allowing for a variety of film thicknesses (including a very thin coat
specifically intended for lift-off processes, called OmniCoat).
It can be patterned using a photoresist masking process, and is somewhat
photosensitive in and of itself. The benefit of using this material is that it
will not be affected by the solvents in SU-8, while positive photoresist layers
will be, causing some interaction between the SU-8 film and the photoresist.
Best Regards,
Chad Brubaker
EV Group invent * innovate * implement
Technology - Tel: (602) 437-9492, Fax: (602)437-9435 e-mail:
[email protected], www.EVGroup.com
This message and any attachments contain confidential or privileged information,
which is intended for the named addressee(s) only. If you have received it in
error, please notify the sender immediately and then delete this e-mail. Please
note that unauthorized review, copying, disclosing, distributing or otherwise
making use of the information is strictly prohibited.
-----Original Message-----
From: [email protected] [mailto:mems-talk-
[email protected]] On Behalf Of lgovinda
Sent: Wednesday, March 24, 2004 11:40 AM
To: [email protected]
Subject: [mems-talk] photoresist as a sacrificial layer:abhiram
Hi all, my name is abhiram govindaraju and i am currently working on a
research project which involves testing of the mechanical properties at
the micron scale specimens.
i would like to know if anyone has used a photoresist layer as a
sacrificial layer to make SU-8 specimens at the micron scale, say 100 x
20 x 5 microns.
for the SU-8 specimens, releasing such small specimen is a problem as
the cantilever beam does not have enough stiffness and they start to
curl over.Si02 can't be used as a sacrificial layer as BHF would react
and effect the SU-8 structure while we use it to etch of the Si02 layer.
so i thought why not go for a very low material properties photoresist
layer which can be used as a sacrificial layer.so could any one of you
help me in finding the right material and the right etchant to remove
the sacrificial layer.
thanking you.
regards
abhiram.
_______________________________________________
[email protected] mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.memsnet.org/
