Hi all,
I have to do DRIE to separate some of my devices which are built in the
bulk of silicon. To do the DRIE I have to bond the wafer from the back
side otherwise the devices will just fall off, which I can't afford.
So I am looking for some material which I can use to temporary bond the
device wafer to a handle wafer, do the DRIE and then take the handle
wafer off, after I have done the final bonding of my devices from the
top side (after DRIE). So my process will be like: 1. Pre processing in
bulk of silicon (side 1). 2. Temporary Bond the processed wafer to
handle wafer (from side 2). 3. Through wafer DRIE (side 1). 4. Final
bonding of the wafer, eutectic bonding or something like that (side 1).
5. Take off the temporary bonded handle wafer (side 2).

I will highly appreciate any advice/direction in this matter. Thanks
 Rahul Agarwal