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MEMSnet Home: MEMS-Talk: Temporary Bonding for DRIE
Temporary Bonding for DRIE
2004-04-07
Rahul Agarwal
2004-04-08
Burkhard Volland
2004-04-08
BRAD JOHNSON
2004-04-13
Blunier, Stefan
2004-04-13
Krasniansky Vladimir
Temporary Bonding for DRIE
Krasniansky Vladimir
2004-04-13
Hi Brad,
I'm very interesting in temporary adhesives which can handle up to 300
C, but didn't
success to find any. Highest temp that I find - 130 C. Could you tell me
which companies
produces high-temperature temporary glues ?

Sincerely,

Vladimir Krasniansky,

Process Engineer,

Gal-El (MMIC);

100, Yitzhak Hanassi Blvd., P.O. Box 330 Ashdod 77102, ISRAEL.

Tel 972-8-857-2436/4

Fax 972-8-857-2658

[email protected]




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