Dear all,

I patterned several micro channels on Si wafer and slice them into small
pieces.
The micro channels are 100um wide and 20000um long.
I would like to cover the micro channels with a flattern glass and enable
them to work with 1kg/cm2 water flow inside. I tried anodic bonding but
found it make micro channels not fully combine with the glass on several
points of edge of channels. Any suggestion about the bonding technology?

thanks,
hsia