Hello,

I usually do bonding of micro chanels etch in silicon wafers with glass
corning #7740 (wich  contains  sodium ions).  Temperature must be
between 300 and 400°C during experiment. I apply a voltage of 1000V
between the two electrodes and a little pressure is necessary to
maintain the stack.

sincerely


--
Emeline MERY
Doctorante
Laboratoire de Physique de la Matière (LPM)
UMR CNRS 5511
INSA de Lyon
7 avenue Jean Capelle, bât. Blaise Pascal
69621 VILLEURBANNE CEDEX
Tél. : (33) 4 72 43 87 95
Fax : (33) 4 72 43 60 82