Gavin,
You may actually want to try a syringe. Be careful to make sure that you use
one without any lubricant or rubber o-ring; you don't want to introduce any new
variables by mixing in additional chemicals.
Also, to fill the syringe, you may want to first pour the SU-8 carefully into a
beaker. Best bet is to pour slowly down the side to avoid introducing bubbles
(kind of like beer...) Then draw into the syringe slowly, trying to avoid any
small bubbles (the big ones will settle themselves out).
This will allow you to place the syringe nozzle cose to the wafer surface for
dispense, and avoid the "folding" effect of trying to dispense from to great a
height.
Best Regards,
Chad Brubaker
EV Group invent * innovate * implement
Technology - Tel: (602) 437-9492, Fax: (602)437-9435 e-mail:
[email protected], www.EVGroup.com
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-----Original Message-----
From: [email protected] [mailto:mems-talk-
[email protected]] On Behalf Of Gavin Wu
Sent: Wednesday, April 21, 2004 9:45 AM
To: [email protected]
Subject: [mems-talk] SU-8 spin coat
Dear all,
I am a novice on using SU-8. I've ordered MicroChem 2025 and tried to
spin-coat a 2" wafer. Since SU-8 is really thick and sticky, I applied it onto
the wafer surface before spinning with a small beaker instead of a pipette. I
also slowed down the accelerating ramp of the spinning chuck. But I've never
been able to get a uniform layer or smooth surface without streaks. I know the
problem might be in the bubbles generated when applying the SU-8, which is
kinda unavoidable. Anyone has a better idea on the *tool* (I mean beakers,
pipettes, etc) for applying SU-8? Or anyone know the secret of getting a
uniform layer?
I guess the answer could be somewhere in the archive. But I just need an
answer really quickly. Thanks very much.
Gavin
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